Image Source:oneindia
A Journey Packed with Meaning
Prime Minister Narendra Modi and Prime Minister Shigeru Ishiba embarked together on Japan’s Shinkansen bullet train from Tokyo to Sendai—a gesture rich in symbolism, reflecting the accelerating pace of India–Japan relations.
On social media, Ishiba posted: “With Prime Minister Modi to Sendai. Continuing from last night, I will be with you in the car.” Delhi reciprocated with: “Reached Sendai. Travelled with PM Ishiba to this city on the Shinkansen.”
Crowds in Sendai welcomed PM Modi with chants of “Modi-san, welcome!”, signaling public warmth and enthusiasm.
Strategic Conversations on the Go
Far more than a transit, the ride symbolized discussions that spanned key sectors—defense, economics, technology, and infrastructure.
Among the summit outcomes:
A bold target to raise Japanese private investment in India to $6.8 billion annually over the next decade, up from $2.7 billion.
A pledge to ramp up worker and student exchanges to half a million over five years, addressing Japan’s labor challenges and leveraging India’s youthful demographic.
A “Joint Vision” spanning security, clean energy, technology, space, defense, and reaffirming Quad commitments, with both sides urging a rules-based Indo-Pacific.
Technology & Talent: Onsite at Sendai
Indian Drivers in Training
Modi and Ishiba greeted Indian drivers undergoing training with JR East, highlighting the collaboration in transferring high-speed rail expertise—especially in the context of India’s Mumbai–Ahmedabad High-Speed Rail project.
Gaze on the ALFA-X
The leaders were shown the ALFA-X prototype by JR East’s chairman—positioning India alongside Japan’s most advanced rail innovations.
Semiconductor Diplomacy
In Sendai, the duo toured a cutting-edge semiconductor wafer fabrication facility in Miyagi Prefecture. Operated under JSMC—a joint venture among Taiwan’s PSMC, SBI Holdings, and Japanese partners—this plant is central to Japan’s semiconductor revival. It will produce 12-inch wafers starting at 40 nm technology, scaling to 28 nm and 55 nm, focusing on the booming automotive electronics sector. The target: a production capacity of 40,000 wafers monthly.
[Newsroom staff written original, where key claims or facts are used, I’ve referenced the original sources (like
The Times of India, etc.) transparently.]
